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AS5030
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 6 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Units
Comments
Electrical Parameters
V DD
Supply voltage
-0.3
7
V
Except during OTP programming
V IN
Input pin voltage
VSS - 0.5 VDD + 0.5
V
I scr
Input current (latch-up immunity)
-100
100
mA
Norm: Jedec 78
Electrostatic Discharge
ESD
Θ JA
Electrostatic Discharge
Package thermal resistance
±2
137
89
kV
°C/W
°C/W
Norm: MIL 883 E method 3015
Still Air / Single Layer PCB
Still Air / Multilayer PCB
Temperature Ranges and Storage Conditions
T strg
T BODY
MSL
Storage temperature
Body temperature
Humidity non-condensing
Moisture Sensitive Level
-55
5
3
+150
260
85
°C
°C
%
Min -67oF; Max +257oF
The reflow peak soldering temperature
(body temperature) specified is in
accordance with IPC/JEDEC J-STD-020
“Moisture/Reflow Sensitivity Classification
for Non-Hermetic Solid State Surface
Mount Devices”.
The lead finish for Pb-free leaded packages
is matte tin (100% Sn).
Represents a maximum floor time of 168h
www.ams.com/AS5030
Revision 2.4
5 - 44
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